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Industrial Masking
Industrial Masking
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Die-cutting Waste Removal

Die-cutting Waste Removal

Used for die-cutting and flexible printed circuit boards (FPC). No-residue waste removal, temporary fixing, hot pressing protection, and bonding protection for display panels/touch screens/light panels.

Electroplating Masking

Electroplating Masking

Mask non-plated areas to prevent electroplating solution penetration. In circuit board processing scenarios, high-temperature resistant tapes are used for welding protection and insulation. In aerospace applications, they are used for heat insulation of precision components, circuit insulation, and cabin sealing. SMT Chip Scenarios: High-temperature resistant tapes mask heat-sensitive components of circuit boards.

Painting Masking Industrial

Painting Masking Industrial

Masking protection during painting operations for rail transportation, home appliances, chassis, aluminum materials, and hardware baking paint.

Powder Coating Masking

Powder Coating Masking

In metal processing scenarios, powder coating masking tapes accurately mask screw holes and interfaces. Commonly used for powder coating of home appliance casings, automobile wheel hubs, filters and power dividers of communication base stations, chassis, cabinets, cavity powder coating masking, circuit board tin spraying masking, original automobile spraying, and high-end repairs in 4S stores.

Industry Pain Points

  • Weak adhesion

    Weak adhesion

    Insufficient sticking force fails to strip off die-cutting waste effectively.

  • Stubborn residue

    Stubborn residue

    Undesirable glue residue remains after tape peeling and contaminates surfaces.

  • Low yield rate

    Low yield rate

    Poor waste removal issues greatly reduce the final product qualification rate. 用英文描述一下解决这些痛点的方法 推荐一些关于Die-cutting Waste Removal的研究论文 提供一些处理Die-cutting Waste Removal问题的视频教程

  • Circuit short circuit

    Circuit short circuit

    Improper protection triggers current short circuits during welding operations.

  • PCB high defect rate

    PCB high defect rate

    Carbonization and residue lead to high defective rate of circuit boards.

  • Component damage

    Component damage

    High temperature in soldering easily causes damage to precision parts.

  • Edge warping

    Edge warping

    Masking tape edges tend to warp during painting, resulting in poor sealing and unstable protection.

  • Paint penetration

    Paint penetration

    Unsealed edges cause paint to permeate non-spray areas and damage product surfaces.

  • Adhesive residue

    Adhesive residue

    Sticky residue remains after tape removal, requiring extra cleaning steps and lowering efficiency.

  • Coating leakage issue

    Coating leakage issue

    High-temperature powder curing causes coating leakage and blurred color separation edges with poor edge sealing.

  • Stubborn adhesive residue

    Stubborn adhesive residue

    Tape leaves residual glue after peeling off, and high temperature leads to adhesive failure easily.

  • Complex masking difficulty

    Complex masking difficulty

    Irregular hardware parts are hard to mask manually with low efficiency and assembly obstacles.

— Selection Guidelines

Select based on battery type (cylindrical/prismatic/pouch), application position (tab/electrode group/casing), and operating temperature requirements.

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