Weak adhesion
Insufficient sticking force fails to strip off die-cutting waste effectively.
language
Used for die-cutting and flexible printed circuit boards (FPC). No-residue waste removal, temporary fixing, hot pressing protection, and bonding protection for display panels/touch screens/light panels.
Mask non-plated areas to prevent electroplating solution penetration. In circuit board processing scenarios, high-temperature resistant tapes are used for welding protection and insulation. In aerospace applications, they are used for heat insulation of precision components, circuit insulation, and cabin sealing. SMT Chip Scenarios: High-temperature resistant tapes mask heat-sensitive components of circuit boards.
Masking protection during painting operations for rail transportation, home appliances, chassis, aluminum materials, and hardware baking paint.
In metal processing scenarios, powder coating masking tapes accurately mask screw holes and interfaces. Commonly used for powder coating of home appliance casings, automobile wheel hubs, filters and power dividers of communication base stations, chassis, cabinets, cavity powder coating masking, circuit board tin spraying masking, original automobile spraying, and high-end repairs in 4S stores.
Insufficient sticking force fails to strip off die-cutting waste effectively.
Undesirable glue residue remains after tape peeling and contaminates surfaces.
Poor waste removal issues greatly reduce the final product qualification rate. 用英文描述一下解决这些痛点的方法 推荐一些关于Die-cutting Waste Removal的研究论文 提供一些处理Die-cutting Waste Removal问题的视频教程
Improper protection triggers current short circuits during welding operations.
Carbonization and residue lead to high defective rate of circuit boards.
High temperature in soldering easily causes damage to precision parts.
Masking tape edges tend to warp during painting, resulting in poor sealing and unstable protection.
Unsealed edges cause paint to permeate non-spray areas and damage product surfaces.
Sticky residue remains after tape removal, requiring extra cleaning steps and lowering efficiency.
High-temperature powder curing causes coating leakage and blurred color separation edges with poor edge sealing.
Tape leaves residual glue after peeling off, and high temperature leads to adhesive failure easily.
Irregular hardware parts are hard to mask manually with low efficiency and assembly obstacles.
Select based on battery type (cylindrical/prismatic/pouch), application position (tab/electrode group/casing), and operating temperature requirements.
