Splicing Double-Sided Tape-DS309H4
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DS10K High Temperature Double-Sided Polyimide Tape is designed for high-temperature bonding and support applications in flexible printed circuit board (FPC) processing. Featuring a polyimide (PI) film backing coated with silicone adhesive on both sides, it offers excellent heat resistance and electrical insulation. With temperature resistance up to 250°C, DS10K provides reliable bonding and support during soldering and other high-temperature processing operations.
| Item NO | Colour |
Colour (mm) |
Max Width (mm) |
Max Length (M) |
MOQ (m²) |
180° Peel Adhesion (N / 25mm) |
|---|---|---|---|---|---|---|
| DS10K | Amber Brown | 0.1±0.005 | 500 | 500~2000M ( can be customized) | 2000 | 5↑ |
| Backing Material | Polyimide (PI) Film |
|---|---|
| Backing Thickness (mm) | 0.025 |
| Type of adhesive | Silicone Adhesive |
| Elongation at break (%) | 50 |
| Tensile strength(N/25mm) | 5↑ |
| Temperature resistance (℃/30mins) | 260 |
| Voltage resistance (kV) | 5 |
| Loop Tack Strength (N) | 2 |
Store at room temperature, away from light. The temperature should be 15-28℃, and the humidity should be 40%-70%.
The selection of high-temperature polyimide tapes should be matched to actual processing conditions, including soldering temperature, processing time, substrate materials, and required electrical insulation performance. For an accurate model recommendation, please consult our sales engineers.
