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Double-Sided Polyimide Tape DS10K
High Temperature Double-Sided Polyimide Tape

DS10K High Temperature Double-Sided Polyimide Tape is designed for high-temperature bonding and support applications in flexible printed circuit board (FPC) processing. Featuring a polyimide (PI) film backing coated with silicone adhesive on both sides, it offers excellent heat resistance and electrical insulation. With temperature resistance up to 250°C, DS10K provides reliable bonding and support during soldering and other high-temperature processing operations.

Quick Specifications
Item NO Colour Colour
(mm)
Max Width
(mm)
Max Length
(M)
MOQ
(m²)
180° Peel Adhesion
(N / 25mm)
DS10K Amber Brown 0.1±0.005 500 500~2000M ( can be customized) 2000 5↑
Additional Specifications
Backing Material Polyimide (PI) Film
Backing Thickness (mm) 0.025
Type of adhesive Silicone Adhesive
Elongation at break (%) 50
Tensile strength(N/25mm) 5↑
Temperature resistance (℃/30mins) 260
Voltage resistance (kV) 5
Loop Tack Strength (N) 2
Key Features
Comes off clean

Comes off clean

Easy to remove

Easy to remove

Excellent high temperature resistance

Excellent high temperature resistance

Our products comply with RoHS standards. Test reports are available upon request.

Our products comply with RoHS standards. Test reports are available upon request.

Storage Condition

Store at room temperature, away from light. The temperature should be 15-28℃, and the humidity should be 40%-70%.

Additional Information

The selection of high-temperature polyimide tapes should be matched to actual processing conditions, including soldering temperature, processing time, substrate materials, and required electrical insulation performance. For an accurate model recommendation, please consult our sales engineers.


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